ARGOS matrix Systems
ARGOS is the most flexible solution on the market for the automatic surface inspection of precision optical components. It can be used to inspect a wide range of optical components from aspheres to mirrors. The ARGOS system also offers automated batch testing of multiple parts as well as simple testing of individual optics. The modular design allows the inspection range and resolution to be individually adapted to your application.


ARGOS matrix Models

ARGOS matrix 200 and 300
With our ARGOS matrix 200 and 300 table systems, you can perform a wide range of inspections using just one device. From measuring individual components to entire batches of precision optics – the inspection area of 205 x 205 mm or 305 x 305 mm can be used flexibly to suit your needs. The ARGOS matrix 200 and 300 are suitable for use in ISO Class 6 cleanrooms.

ARGOS matrix 400
ARGOS matrix 400 is our solution for measuring particularly large optics and series testing of even more optical components. Optics weighing up to 100 kg can be measured in a test area of 400 x 600 mm. The system is fully enclosed and has an integrated air filter. The ARGOS matrix 400 is suitable for use in ISO class 6 cleanrooms.

Modular Measurement Heads
The ARGOS systems can be equipped with different modular measuring heads (S/M/L) on delivery. The S measuring head is suitable for the highest resolution requirements. It can detect defects from 1 µm. With the L measuring head, on the other hand, test specimens can be tested automatically with a significant reduction in measuring time.
System sizes
ARGOS matrix | 200 | 300 | 400 |
---|---|---|---|
Maximum inspection area | 205 mm x 205 mm | 305 mm x 305 mm | 600 mm x 400 mm |
System size (L x W x H) | 645 mm x 520 mm x 700 mm | 845 mm x 720 mm x 700 mm | 1510 mm x 1085 mm x 2322 mm |
Power consumption rated / typ | 1140 W / 400 W | 1140 W / 400 W | 1360 W / 500 W |
Measuring head variants
The modular design of the ARGOS systems makes it possible to choose between different measuring head variants. The resolution of the measuring head can be selected according to the inspection requirements and priorities in order to reliably detect even the smallest relevant defects or to optimize the measuring time.
Measurement head | Measurement head S | Measurement head M | Measurement head L |
---|---|---|---|
Nominal resolution (object-side pixel pitch) | 3.0 µm | 5.0 µm | 7.5 µm |
Camera field of view | 13.7 mm × 13.7 mm | 22.4 mm × 22.4 mm | 33.6 mm × 33.6 mm |
Smallest ISO 10110-7 size grade | 0.004 (digs), 0.0025 (scratches) | 0.0063 (digs), 0.004 (scratches) | 0.01 (digs), 0.0063 (scratches) |
Smallest visible defects1/2 | < 1 µm | < 2 µm | < 3 µm |
Reproducibility of the size measurement1/3 | < 1.5 µm | < 3 µm | < 4.5 µm |
Inspection example: 8″ wafer4 | 12 min | 4 min | 2 min |
Inspection example: Lens, D = 30 mm, flat4 | 18 s | 11 s | 7 s |
Inspection example: Lens, D = 30 mm, R = 30 mm4 | 4 min | 2 min | 15 s |
Datasheet | Datasheet |
2Smallest visible defects: Small defects will be assigned the minimum grade number 0.0025/0.004/0.0063.
3Reproducibility of the size measurement: Mean standard deviation of measured defect sizes for 30 repetitions with the same calibration sample.
4Inspection duration: The evaluation time depends on the specification and quality of the surface.
The ARGOS Family
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